In PCB board production, the uneven bonding of gold finger tape is a frequent and problematic issue that can affect the circuit board's performance. The main reasons are inaccurate cutting dimensions and improper handling. To solve this, high - precision cutting tools should be used to cut the tape according to the actual gold finger size. A segmented application method is recommended, where one end is fixed first and then the tape is advanced slowly while using a squeegee to remove air. Tweezers can be used to adjust existing wrinkles or bubbles. By following these steps strictly, the problem of uneven bonding can be overcome.
During PCB board production, uneven bonding of gold finger tape is a common and troublesome issue. Uneven bonding leads to poor contact between the gold fingers and other components, compromising the circuit board's performance.
The primary causes of uneven bonding are inaccurate cutting dimensions and improper handling techniques. If the cut tape dimensions do not match the PCB's gold finger area, achieving a flat bond becomes difficult. During application, uneven pressure or excessive speed can easily cause wrinkles and air bubbles in the tape.
To resolve this challenge, high-precision cutting tools must first be employed to accurately trim the tape according to the actual gold finger dimensions. During application, adopt a segmented approach: secure one end first, then slowly advance towards the opposite end while gently smoothing with a squeegee to expel air. Any existing creases or bubbles can be carefully adjusted using tweezers. By strictly adhering to these steps, the challenge of uneven gold finger tape adhesion on PCBs can be overcome
