During semiconductor packaging, the occurrence of bubbles in gold finger tape is a common problem, as these bubbles compromise the quality and reliability of the package.
The primary cause of bubble formation is incomplete air removal during application. This may result from excessive application speed, gaps between the tape and substrate surface, or elevated ambient humidity.
To resolve this issue, ensure the working environment is dry and clean prior to applying the gold finger tape. During application, proceed slowly while simultaneously using a squeegee or similar tool to expel trapped air. Begin at one end of the tape and advance gradually towards the other, facilitating smooth air release. Should bubbles already form, puncture them using a needle or other sharp instrument before pressing the tape firmly with the squeegee. These methods effectively resolve bubble formation issues with gold finger tape during semiconductor packaging.
