The electroplating process has extremely strict requirements on the performance of shielding materials. It not only needs to have excellent acid and alkali resistance, but also needs to meet core requirements such as high-temperature baking (usually 60℃-120℃), high adhesion and no residual adhesive. LVZHIMEI plating tape perfectly adapts to various electroplating working conditions through special substrate selection and adhesive formula research and development. This product uses high-strength PET film or polyimide film as the base material, coated with acid and alkali resistant special pressure-sensitive adhesive, and processed through a special curing process, with extremely strong acid and alkali corrosion resistance. It can be soaked in common electroplating solutions such as sulfuric acid, hydrochloric acid and cyanide for a long time (more than 24 hours) without swelling or degumming, effectively shielding non-electroplating areas and ensuring precise deposition of electroplating layers.
In the PCB electroplating scenario, accurately shielding gold fingers, pads and other parts that do not need electroplating is the key to ensuring product performance. LVZHIMEI plating tape has excellent dimensional stability and adhesion, can accurately cover the shielding area, avoid plating layer accumulation caused by electroplating solution penetration, and thus prevent PCB short circuit or signal transmission abnormality. Aiming at the high requirement for PCB surface flatness, this tape has no bubbles or wrinkles after bonding, can be easily peeled off after electroplating, no residual adhesive remains, no additional cleaning process is needed, and production efficiency is greatly improved. In the metal part electroplating scenario, for difficult-to-shield parts such as complex curved surfaces and edges, LVZHIMEI plating tape has excellent flexibility, can closely fit the substrate surface, effectively prevent electroplating solution from penetrating through gaps, and has good mechanical strength, which can resist stirring impact and friction during electroplating, ensuring shielding stability.
For common problems in the electroplating process, LVZHIMEI technical team has summarized systematic solutions: degumming is mostly caused by incomplete cleaning of the substrate surface and poor compatibility between the adhesive and the electroplating solution. It is recommended to use LVZHIMEI special plating tape. Before construction, clean the substrate surface with absolute ethanol to remove oil and oxide layer and enhance adhesion; overflow adhesive is caused by improper tape width selection or excessive construction pressure. It is necessary to accurately cut the tape width according to the shielding area and control the construction pressure at 0.3-0.5MPa to avoid adhesive layer extrusion and overflow; residual adhesive relies on LVZHIMEI special acid and alkali resistant adhesive formula, which is closely combined with the substrate, no adhesive layer transfer during peeling, and can withstand the high-temperature cleaning process after electroplating, completely eliminating residual adhesive pollution; shielding failure is mostly caused by tape damage or poor bonding. It is recommended to use high-strength products with thickness ≥50μm, and compact the edges with a scraper during bonding to ensure no gaps. In addition, LVZHIMEI can customize and adjust tape formulas and specifications according to different electroplating solution components, temperatures and shielding needs, providing one-stop process protection solutions.
