Industrial tape application is a systematic work that needs to take into account substrate characteristics, environmental conditions, tool selection and operation specifications. Omissions in any link may lead to bonding failure and affect product quality. Based on thousands of application cases, LVZHIMEI technical team found that four major problems - bubbles, degumming, edge warping and adhesive overflow - account for more than 80% of construction failures, and most of them are caused by irregular operation, inappropriate environment or improper product selection. These problems can be effectively reduced through scientific management and control.
Bubble problem is the most common construction failure, which is mainly caused by incomplete cleaning of the substrate surface (residual oil, dust, moisture), excessive humidity in the construction environment (＞60%), insufficient rolling or messy direction. Preventive measures for this problem are: clean the substrate surface with isopropanol or absolute ethanol before construction, and bond after completely dry (no water marks, no odor on the surface); control the construction environment humidity at 30%-60% and temperature at 15-25℃, avoid construction in humid and low-temperature environments; use rubber roller or silicone roller to roll unidirectionally 3-5 times, and control the rolling pressure at 0.2-0.4MPa to ensure tight bonding between the tape and the substrate and exhaust air. If bubbles have appeared, small-area bubbles can be exhausted by needle pricking and then compacted with a roller, while large-area bubbles need to peel off the tape, clean the substrate again and bond.
Degumming is mainly caused by low surface energy of the substrate (such as PP, PE materials), insufficient temperature resistance/environmental resistance of the tape or insufficient curing time. The solutions are: for low surface energy substrates, use LVZHIMEI special primer or tape suitable for low surface energy materials to improve adhesion; select tape with corresponding performance according to the construction environment, high-temperature resistant tape for high-temperature environments, and waterproof tape for humid environments; extend the curing time, and carry out subsequent processes only after curing at room temperature for 24-72 hours to avoid degumming due to premature stress. Edge warping is mostly caused by insufficient tape thickness (＜0.1mm), insufficient edge rolling or uneven substrate edges. It is recommended to use tape with thickness ≥0.1mm, focus on compacting the edges with a scraper after pasting (compacting each edge more than 3 times), and preprocess (grind, level) the uneven substrate edges.
Adhesive overflow is caused by excessive tape width selection, high construction pressure or thick adhesive layer. It can be avoided by accurately cutting the tape width (1-2mm narrower than the shielding area), controlling the construction pressure within a reasonable range, and selecting thin adhesive layer products. If adhesive overflows, it can be wiped with isopropanol before curing; after curing, the adhesive layer can be softened by a hot air gun (temperature 60-80℃) and then peeled off, avoiding hard scraping to damage the substrate surface. In addition, LVZHIMEI reminds users that small sample testing before construction can effectively verify product adaptability and construction plan feasibility, and regular training for construction personnel to standardize operation processes can significantly improve construction qualification rate.
