Green high-temperature tape is indispensable in semiconductor processing, securing wafers and protecting them during high-temperature processes like dicing and backgrinding. Its precision and heat resistance ensure the quality and yield of semiconductor devices.
Semiconductor manufacturing involves precise and delicate processes, such as wafer dicing, backgrinding, and packaging.
Green high-temperature tape is used in these processes to secure wafers and protect them from damage. During wafer dicing, the tape holds the wafer in place, preventing movement that could cause cracks or breaks.
Its heat resistance ensures it remains stable during the dicing process. In backgrinding, the tape protects the wafer’s surface from scratches and contamination.
The tape’s precise adhesion and easy removal make it ideal for semiconductor processing. It ensures the integrity of wafers, contributing to the high yield and quality of semiconductor devices.
