Green high-temperature tape is vital in SMT assembly, protecting sensitive areas and securing components during high-temperature reflow soldering. Its heat resistance and precise adhesion ensure the quality and reliability of electronic circuits.
Surface Mount Technology (SMT) a widely used methods for assembling electronic circuits.
It involves placing components directly onto the surface of PCBs, followed by a reflow soldering process that exposes the board to high temperatures.
Green high-temperature tape is extensively used in SMT to protect sensitive areas and components during this process.
For example, the tape is used to shield connectors, test points, or areas with exposed copper from solder paste application and reflow heat. Its ability to withstand temperatures up to 260°C ensures it remains intact during the reflow process, preventing damage to protected areas.
The tape’s precise adhesion and easy removal also make it ideal for temporary masking applications. In addition to protection, green high-temperature tape is used to secure components during placement and soldering.
Its heat resistance ensures it does not melt or lose adhesion, even under extreme conditions. This reliability is crucial for maintaining the integrity of the assembly process and ensuring the final product’s quality.
